Industry experts at solving reliability and residue problems

Foresite cleanliness limits

Our research sets PCB assembly cleanliness limits used throughout the industry.

 

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Case study: Finding Residue Sources

Process methodology helps pinpoint the root cause.

 

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Recently, a client experienced a high rate of product returns that were identified as no trouble found (NTF) when bench tested. The assembly included a hand-soldered connector on the wave solder side of the assembly. A low-solids no-clean paste, wave… Read more»

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