Visible white residues often perturb assemblers. This article gives a concise outline of the situations that create white residues, and how to combat them. The implications of white residues really depend on the processing parameters that cause them such as what type of flux is used, the cleanliness of components and bare boards as well as whether or not a soldermask is used. Whatever the case, good analysis is the key to determining whether or not a white residue is a reliability risk.

Foresite is gearing up to display the C3 Localized Cleanliness Tester at the upcoming Pan Pacific Microelectronics Symposium. At this conference, Foresite will be presenting a paper and research findings on how localized extraction is particularly relevant to lead free assembly. We will be publishing our findings on our website once the conference wraps, so stay tuned.

January 17th has arrived, and Foresite's president Terry Munson is on site at the Pan Pacific Microelectronics Symposium preparing to give his speech on how localized contamination affects lead free assembly. Terry Munson will be giving the opening presentation for the Pan Pacific conference, so make sure not to miss it if you are in attendance in sunny Hawaii, and stop by to see a live demonstration on the C3!

Foresite's lab has been busy qualifying new lead free processes for clients to ensure long term reliability, and is now introducing services for lead free verification. We are currently evaluating a new form of XRF technology for use in determining lead free compliance. If you have a need to determine lead free compliance, contact Foresite.

The Indiana chapter of the SMTA is having their second meeting in southern Indiana, just north of Louisville, KY. Key Electronics is the host for this event, and there will be a plant tour. Tim Murphy of Thomson Electronics will also be giving a special presentation on PB-Free Surface Finishes, so please plan to attend this event if you are in the region!