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Areas of Extraction for Process Evaluation

This page gives examples of where tests should occur when using the C3.

 

 



 

 

 

 

 

 

Typical Areas of Extraction for Process Evaluation

Additional Areas to Test

  • Incoming Bare Boards

  • Incoming Components

  • Reworked Component Areas

  • Sites of Visible Corrosion

1st Side SMT Low Standoff Area

 

2nd Side SMT Low Standoff Area

 

Connector Leads from Selective Soldering

 

Bare Board Area with No Active Circuitry

 

Open Holes and Vias with Kapton Tape

 

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