C3 Areas to Test

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Areas of Extraction for Process Evaluation

This page gives examples of where tests should occur when using the C3.

Typical Areas of Extraction for Process Evaluation

1st Side SMT Low Standoff Area (view photo)
2nd Side SMT Low Standoff Area (view photo)
Connector Leads from Selective Soldering (view photo)
Bare Board Area with No Active Circuitry (view photo)
Open Holes and Vias with Kapton Tape (view photo)

Additional Areas to Test

Incoming Bare Boards
Incoming Components
Reworked Component Areas
Sites of Visible Corrosion

1st Side SMT Low Standoff Area

2nd Side SMT Low Standoff Area

Connector Leads from Selective Soldering

Bare Board Area with No Active Circuitry

Open Holes and Vias with Kapton Tape


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