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Due to the popularity of our
Understanding Process Residues and Their Effect on Product
Performance workshop, Foresite has decided to expand upon
the knowledge brought forth in this educational event, and offer
it in a two day format with the addition of expanded
information on implementing lead free processes and conducting
failure analysis
investigations.
In this workshop, we will share our
latest insights on electronic product cleanliness, how it is
affecting product reliability and how you can best adapt your
processes with changing technologies and chemistries to produce
clean and reliable hardware. In-depth information on
successful implementation of a lead free process and conducting
an effective and efficient failure analysis investigation will
also be presented.
Event
Details
Date: Wednesday & Thursday, March
16 & 17, 2005
Registration & Networking: 9:00 am - 10:00 am EST
Event Time: 10:00 am to 4:00 pm EST
Location: Inventrek - 700 E. Firmin Street, Kokomo, IN
46902
Price: $1200.00 for the full 2-day seminar
Price includes lunch and a workbook both days
*If you prefer to attend only the first or second day, you may
do so for $795.00, which includes lunch that day and a workbook
outlining the topics covered that day
**Participants of our one day workshop in December are entitled
to a discount on the second day of this workshop. Contact us for
details.
***Special Offer: Companies with 3 or more attendees may qualify
for a discounted rate. Contact us for details.
Workshop Topics
Day 1 :
Understanding Process Residues and their Effects on Product
Performance

-Definition and critical issues affecting
cleanliness
-Contaminant types, sources and
prevention
-How will Lead Free processes affect
soldering
residues
-Effects of process residue contaminants
-Cleanliness issues with varying primary
& secondary
processes
-Impact of technology, chemistries,
materials and
packaging choices
-Conducting process qualification
-Cleanliness effects on conformal coating
-Methods to baseline and monitor
cleanliness
-Cleaned vs. no-clean assemblies
-Cleaning a no-clean assembly
Day 2 :
Implementing and Qualifying a Lead Free Process, and Conducting
an Effective Failure Analysis Investigation
-Process, Material and Equipment
Considerations for Implementing Lead Free
-Getting control of the factors such as
higher dross associated with lead free manufacturing
-Cleaning a Lead Free Assembly
-Reliability concerns and process defects
associated with lead free
-Tin & Zinc whiskers: mitigation
and prevention
-Qualifying a lead free process
-Testing methodologies in qualifying a
lead free process
-Qualifying suppliers to optimize your
lead free process
-Investigative approach in conducting a
failure analysis
-Determining the root cause in a failure
analysis
-Common causes and preventative measures
for common field failures
-Steps to determine corrective actions
from a failure analysis
These topics and more will be exemplified
using real-life case studies and process knowledge
gained through Foresite's 15 years of experience in helping
customers solve product reliability concerns and build reliable
hardware.
About the Instructor
Terry Munson, President of Foresite
Inc, has extensive electronics industry experience in applying
Ion Chromatography analytical techniques to a wide spectrum of
manufacturing applications. Foresite is a failure analysis and
process assessment facility with expertise in solder joint
quality and residue effects on electronic hardware.
Terry currently chairs the IPC Rework
Cleaning Task Group and has spent 16 years participating with
the IPC task group activities on CFC elimination, no-clean
fluxing, and aqueous cleaning.
Register Now
You can pay online by check or credit card with paypal,
fill out a form to pay with a PO# or you can pay by phone by
contacting our office at (765)457-8095.
Contact
Us
You can also contact us if you have any
further questions about upcoming events or on-site training
programs. Feel free to email us,
foresiteinfo@residues.com, or call us, at (765)457-8095
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