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Resources : Photos of Electronic Assembly Failure Mechanisms

Photo Library:  Page 3
 

These photos exemplify some of the reliability issues that Foresite encounters & solves on a regular basis.  If you have any questions about the images, or have any thoughts on additional problems we can photo and document, email ForesiteInfo@residues.com.

 

Click on the thumbnails or links to see full size images.

 

Solderball on Assembly

 

Thermally Overstressed Solder Joint

 

Close up view of Thermally Overstressed Solder Joint

 

Through Hole Leakage with no Visible Residue

 

 

White Flux Residues Around Connector Pins

 

Heavy White Residues

 

 

Adhesive Corrosion Causing Metal Attack

 

 

Close up view of Copper Sulfate Crystalline Growth

 

 

Close up of Dendrites Growing between Component Leads

 

Close up of White Residue under BGA Component

 

Copper Sulfate Crystals Bridging

 

 

Corrosion on Component Surface

 

Corrosion and Visible Debris

 

Crystalline Copper Sulfate Crystals

 

Crystallized Flux


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