The C3 stands for Critical Cleanliness Control. It was developed to meet an industry need to test critical areas of printed circuit assemblies to examine cleanliness issues that may lead to field failures. The C3 is designed to be used as a process control tool on the production floor or in a lab setting. Being on the production floor saves both time and money and allows for immediate feedback as to the cleanliness of a printed circuit assembly. This knowledge leads to a more reliable product and a more satisfied customer.

This photo shows what can happen when boards are not properly baked dry. Although the board may have looked dry, there is still some moisture trapped under the DIP component from cleaning. When the board is heated up during conformal coating and cure, it releases this moisture, which creates bubbles. The conformal coating is heavy enough to trap these bubbles on the board, leading to a board failure.