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Residue News A newsletter by Foresite Inc.
August 2008

Greetings!

Welcome to the August issue of Residue News

We're Back . . This past year Foresite has been remiss in providing the monthly newsletter to those of you on our subscribers' list. Starting in 2009, we will be sending out a quarterly newsletter with information relating to industry issues, cleaning problems and options, and what we are seeing in the realm of testing.

Thank you for your patience as we get the newsletter back into a regular cycle.

In this issue
  • C3 Awarded SMT Magazine's 2008 Vision Award for Test Equipment
  • Upcoming Events
  • Meet the Problem
  • Partnership with China Laboratory (Microtek) in the Works
  • Upcoming Events
    Foresite staff will be participating in some upcoming industry events. See us at SMTAI in Orlando and IPC Midwest in Chicago.

    Terry Munson will be presenting, "Why are QFN and PQFN Packages Failing Due to Leakage and Stray Voltage Problems?" at the AIMS Harsh Environment Electronics Workshop. His presentation will be during Session 4 on Monday, August 18, 2008. The presentation will include: advantages of this component package style, problems associated with the smaller package, and new ideas to resolve the current issues.

    Eric Camden will be presenting, "Challenges and Solutions of Cleaning No-Clean Flux Residues from Surface Mount Components," at SMTAI. His presentation will be on Tuesday, August 19, 2008, at 1:30 p.m. in Coronado D. Eric will discuss the procedures and effectiveness of cleaning electronic hardware that has been assembled with a no clean flux and exhibits a corrosive contamination problem. What are the issues and what is an effective recovery plan?

     

    Meet the Problem
    How Clean Are Plugged Microvias?

    Microvia contamination from the fabrication process is not new, but is leading to a new appearance in immersion tin, silver and OSP boards. Besides microvias (holes with a 0.013" or smaller opening) with visible attacks on the metalization surface, we are seeing open or intermittent open cracked vias. These small openings are plugged on one side and function as a turned-up cup in a dishwasher. Wash and rinse water get inside and do not flush out easily, leaving corrosive residue.

    The complete article can be viewed in the July 2008 edition of Circuits Assembly at www.circuitsassembly.com. Terry Munson is a monthly contributor as the Process Doctor.

     

    Partnership with China Laboratory (Microtek) in the Works
    Foresite is pleased to announce a partnership in China with Microtek Laboratories. We are in the process of getting our equipment installed and operational in Microtek's Changzhou facility. Our vision is to provide our Asia-Pacific customers an alternative to shipping product to our U.S. facility for testing, resulting in quicker, lower-cost test results.

    Foresite, in conjunction with Microtek, will process samples and provide a detailed report with photo documentation, sample data, conclusions, and recommendations.

    Paco Solis, Foresite Lead Investigator, will be spending part of September at Microtek, training the staff on equipment and Foresite procedures. If you would like additional information regarding the timeline and testing available, please email us at foresiteinfo@residues.com.

    C3 Awarded SMT Magazine's 2008 Vision Award for Test Equipment
    Tracy, Eric, and Paco with Vision Award in Las Vegas

    Foresite, Inc.'s C3 Critical Cleanliness Control was awarded SMT Magazine's 2008 Vision Award for Test Equipment. The presentation was made at the annual IPC Printed Ciruits Expo / APEX / Designers Summit in Las Vegas, Nevada, to Aqueous Technologies, Foresite's worldwide distribution partner.

    The C3 is based on a U.S. patent by Terry Munson, President, Foresite, Inc. Foresite has also received patents for the C3 in Germany, China and the United Kingdom. Our most recent milestone has been conforming the C3 to CE mark directives.

    Foresite is continually looking at ways to better our product offerings, including the C3. We have developed a prototype for a portable C3 that will ease transportation between production floors or plant locations. Also in development are different test cells, ranging from a cell that will allow testing of small (QFN) component areas to one for larger (BGA) components.

    Please select the "C3 Information" link below for more detailed information about the C3.

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