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Greetings!
Welcome to the November issue of Residue News
| Upcoming Events |
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* With the Holiday season fast approaching we will be
staying close to home and planning our schedules for 2010.
* The Foresite offices will be closed November
26th and 27th for Thanksgiving. We will
also close December 24th and re-open January 4,
2010.
* The staff at Foresite wishes everyone a Happy Holiday
Season!
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| Meet the Problem |
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Under-Cured Soldermask Porosity
In a recent client study, we observed that under-cured
soldermask samples were absorbing extraction solution. Steam
extractions, along with bag extractions, were performed using
the C3 (Critical Cleanliness Control). At each localized
extraction site, a visible color change occurred on the board
surface, highlighting the potential problem. Figure 1 depicts
the bare board prior to the C3 extraction. Figure 2 is the
same location after the C3 extraction.
Three groups of bare boards were evaluated utilizing the C3
and ion chromatography (IC). The groups included: 1. bare
boards from inventory, 2. no-clean fluxed and wave-soldered
boards, and 3. bare boards exposed only to wave-solder with no
flux. IC data on the bare boards showed high levels of sulfate
and ammonia. The boards also had a visible color change at the
extraction locations. The second group of boards (no-clean
fluxed and wave-soldered) had high levels of chloride,
sulfate, WOA (Weak Organic Acids), sodium and ammonia, and
also exhibited the color change. The group of boards that were
wave-soldered without flux had no visible color change and IC
results were within Foresite recommended cleanliness limits.
Heat was applied for fifteen seconds, with a heat gun, to
the boards with the color change. The additional heat appears
to have improved the cure and minimized the mask porosity.
After heat, ten lines were cut into the mask and they were
re-tested with IC. Data indicated low levels of chloride,
sulfate, WOA, sodium and ammonia. The mask color also returned
to dark green.
Under-cured soldermask can be a problem if the
water-soluble flux is not properly cleaned, allowing corrosive
flux residues to become trapped in the mask. Once trapped, the
residues are difficult to clean using deionized water or a
batch cleaner. Initial indications are that the C3 is capable
of detecting porous soldermask and identifying levels of ionic
entrapment in the mask. Optimizing the soldermask cure is
critical in reducing the mask porosity and ionic
contamination.
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| Attention: C3 Users |
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Foresite is in the process of starting a user group
for our customers with C3s. We have made attempts in
the past to initiate some form of correspondence to answer
your questions, provide helpful hints, or let you know of
upcoming developments with the C3; now we hope to put a system
in place that allows for better communication.
We are excited about new developments and changes
forthcoming with the C3 and hope to keep you informed, as well
as, solicit your input.
If you have a C3 or are interested in more information
contact Eric Camden at ericc@residues.com.
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Phase II Grant Awarded |
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We have been awarded a Phase II Small Business Technology
Transfer grant from the Missile Defense Agency of the U.S.
Department of Defense to continue our research, over the next
two years, on the influence of electronic surface contaminants
on the nucleation and growth of tin whiskers. The phenomenon
of tin whiskers, while experienced in electronics for decades,
has become a greater threat due to efforts to remove lead from
electronic assemblies.
Failure analysis projects at Foresite for various clients
have revealed a connection between process residues and tin
whiskers, a connection that has not been prevalent in the
extensive research conducted on metallic whiskers since 1945.
We intend to document the role residues play and, ultimately,
to develop an effective, accelerated test method to predict
tin whisker growth on electronics.
Purdue University's Materials Engineering Department, West
Lafayette, Indiana, is collaborating with us on this research
under the direction of Professor Carol Handwerker, who
specializes in the growth of nanowires and nanostructures as
well as the manufacturing and reliability of lead-free
solders. |
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